Anthropic adds dashboard and animation tools to Claude
The company also moved Claude Docs, Slides and Design out of beta, making them generally available on all Claude plans.
GlobalFoundries signs $2 billion agreement to supply AI chip components to TSMC
The five-year agreement calls for expanded manufacturing capacity in New York, with volume production expected to start ramping up in early 2028.
GlobalFoundries said on October 8 that it had agreed to manufacture silicon interposers for TSMC under a five-year, $2 billion agreement. The company will add production capacity at its plant in Malta, New York, to supply the components used in advanced AI chip packages.
Silicon interposers sit below processors and memory chips, allowing them to exchange data at high speeds. Demand for advanced packaging exceeds manufacturing capacity, making it a major bottleneck for AI chip production.
GlobalFoundries said the Malta plant is expected to be the first U.S. manufacturing source for silicon interposers used in advanced packaging. Volume production is expected to start ramping up during the first half of 2028. The agreement also establishes a framework to add capacity in the future as packaging demand grows.
GlobalFoundries shares rose about 4% in premarket trading on October 8.