Banks and Blackstone to provide $63 billion for Anthropic chip deal
A new special purpose vehicle will buy Broadcom equipment and lease it to Anthropic, with deliveries expected to start in 2027.
Applied Materials plans to lift BESI holding to about 20%
The additional share purchase is subject to US antitrust review, and Applied Materials said it would not seek a BESI board seat.
Applied Materials said on October 26 that it plans to increase its ownership of Dutch semiconductor equipment maker BE Semiconductor Industries (BESI) from 9% to about 20%, expanding their partnership in chip packaging for AI applications.
The company said it had signed an accelerated share purchase agreement covering additional BESI shares, subject to US antitrust review. Applied Materials became BESI’s largest shareholder when it acquired its 9% holding in April 2025.
The broader collaboration will target new technologies for connecting and packaging chips intended for next-generation AI semiconductors. The companies have worked together since 2020 on hybrid bonding, an advanced packaging technique used in high-performance chips.
Applied Materials said it has no plans to take its holding above about 20% or pursue representation on BESI’s board.